清华大学与上海交通大学智能微波光波融合创新中心（imLic）合作的工作——Fully integrated hybrid microwave photonic receiver的相关成果近期被Photonics Research期刊接收发表。该工作将磷化铟（InP）激光器芯片和单片的绝缘体上硅（SOI）光子电路集成在同一衬底上，实现了全集成的混合微波光子接收器。
摘要: Microwave photonic receivers are the promising candidate desired for breaking the bandwidth limitation of traditional radio-frequency (RF) receivers. To further balance the performance superiority with the requirements on size, weight, and power consumption (SWaP), the implementation of integrated microwave photonic microsystems has been considered as an upgrade path. However, up to now, chip-scale fully integrated microwave photonic receivers have not been reported due to the limitation of material platforms. In this paper, we report a fully integrated hybrid microwave photonic receiver (FIH-MWPR) by comprising the indium phosphide (InP) laser chip and the monolithic silicon-on-insulator (SOI) photonic circuit into the same substrate based on the low-coupling-loss micro-optics method. Benefiting from the integration of all optoelectronic components, the packaged FIH-MWPR exhibits a compact volume of 6 cm3 and low power consumption of 1.2 W. The FIH-MWPR supports a wide operation bandwidth from 2 to 18 GHz. Besides, its RF-link performance to down-convert RF signals to the intermediate frequency is experimentally characterized by measuring the link gain, the noise figure, and the spurious-free dynamic range metrics across the whole operation frequency band. Moreover, we have utilized it as a de-chirp receiver to process the broadband linear frequency-modulated (LFM) radar echo signals at different frequency bands (S-, C-, X-, and Ku-bands) and successfully demonstrated its high-resolution ranging capability. To the best of our knowledge, this is the first realization of chip-scale broadband fully integrated microwave photonic receiver, which is expected to be an important step in demonstrating the feasibility of all-integrated microwave photonic microsystems oriented to miniaturized application scenarios.